Low outgassing adhesive
It minimizes outgassing after curing to a very low level, making it ideal for applications in a vacuum.
Outgassing that occurs under high vacuum can adversely affect components and semiconductor devices. At Sunstar Technology, we focused on the mixing ratios of reactive diluents, hardeners, additives (for barrier layer formation), and main agents/hardeners to achieve ultra-low outgassing properties.
- 企業：サンスター技研
- 価格：Other
